Toshiba announces 3D flash memory with TSV technology


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Originally published at: http://www.myce.com/news/toshiba-announces-3d-flash-memory-tsv-technology-82240/

Toshiba today announced development of BiCS FLASH 3D flash memory utilizing Through Silicon Via (TSV) technology with 3-bit-per-cell (triple-level cell, TLC) technology that should increase bandwidth at lower power consumption.