More Manufacturers Exhibit USB 3.0 Physical Layers

A number of LSI manufacturers and IP vendors demonstrated their technologies at the SuperSpeed USB Developers Conference, which took place for USB 3.0 (SuperSpeed USB) developers May 20 and 21, 2009, in Tokyo

Link: http://techon.nikkeibp.co.jp/english/NEWS_EN/20090527/170808/

:cool::cool:

Yay!