I don’t see what the problem is with the cpu host control. Its not a big deal to re-enable it each time you bump up the cpu speed.
you might want to disable the “robust graphics booster” since that will overclock your PCIE bus, we don’t want that to interfere.
So now set you multiplier back to 9. Increase your ‘cpu host frequency’ to about 350 (this is just a slight overclock) and no voltage increase for the cpu should be necessary at this point. Now realize that we don’t want to OC your ram, right now it will only get a small OC, but as you increase the cpu speed you then have to change the ‘system memory multiplier’ to decrease the ram, just try one after the other to see which one puts the ram at a safe speed (safe being below 850MHz) its okay if its a lot lower, right now your are oc’ing the cpu and later the ram can get finalized. When booting into windows you can run coretemp, cpuz. So you can start Prime95 and run either small ffts or large ffts doesn’t matter. Watch the temperature in coretemp to see that it stays below 65C or so, let it run for at least 10 minutes. So basically you have to repeat the above, maybe increasing the fsb another 10-20 each time, eventually prime95 will fail or windows will fail to start or the system while running prime95 will just restart, thats when you have to start increasing the cpu voltage to make it stable, initially it will take 0.50-0.100V increase to get it stable again, after that it should be smaller increments. Your chip should be able to get to 3.8GHz pretty easily. You don’t want to go over a total of 1.4V for the cpu, in cpuz it will tell you the actual cpu voltage.
to see how much faster the cpu is working, you can run the superpi program and run the 1M setting, it will calculate the value of Pi to the 1 millionth decimal point, as you increase the cpu speed it will be able to calculate this faster.
I just got a E7200 and OC’s it to 3.5Ghz, might remove the cpu cover (IHS) to cool it down better. Your chip is soldered to the metal cover, but on mine (more budget) they only glued the sides down and the chip makes contact to the cover with thermal paste, but yours is soldered down which is much better at transferring heat.